AMD Strix Halo: 3D V-Cache Set to Supercharge Mobile APUs

Recent chip design leaks and industry sources indicate that AMD's "Strix Halo" series of mobile APUs, including the Ryzen AI Max+ Pro 395, will incorporate a TSV (Through-Silicon Via) structure to support 3D V-Cache technology.

This design choice not only paves the way for future X3D variants of these processors but also suggests a significant potential for CPU performance gains through the addition of extra L3 cache. Such an enhancement is expected to be particularly beneficial in gaming and professional workloads, where larger caches can dramatically improve processing efficiency.

This move aligns with AMD's strategy of utilizing 3D V-Cache to enhance performance in cache-sensitive applications. By stacking additional L3 cache directly on top of the CPU cores, AMD can provide a substantial amount of super-fast cache memory. This approach has proven effective in other AMD processors, leading to faster game loading times, smoother frame rates, and improved overall system responsiveness.

The presence of TSV connections in the "Strix Halo" die, as confirmed by industry insiders, strongly suggests that AMD is indeed preparing to bring the benefits of 3D V-Cache to its mobile APU lineup. This development is generating excitement among enthusiasts who anticipate further performance leaps in upcoming AMD mobile processors, especially in demanding tasks like gaming and content creation.

Detailed analysis of the Strix Halo chip layout reveals that AMD has strategically reserved space above the L3 cache layer between the Zen 5 cores specifically for 3D V-Cache stacking. This vertical connection is facilitated by TSV (Through-Silicon Via) technology.

Mirroring the design approach of desktop Ryzen X3D processors, this allows AMD to significantly expand the cache capacity without increasing the overall silicon footprint of the chip.

Furthermore, the Strix Halo APU incorporates a brand-new interconnect solution. Compared to traditional SERDES (Serializer/Deserializer) designs, this innovative interconnect achieves a remarkable 42.3% reduction in physical size. This contributes to an overall chip size reduction of 0.34mm while simultaneously lowering latency and power consumption. These advancements not only benefit the Strix Halo generation but also pave the way for the future Zen 6 architecture and its continued pursuit of efficiency and performance.

Performance Prowess: Integrated Graphics Rivaling Discrete GPUs, Efficiency Redefined

Benchmark testing indicates that the Radeon 8060S integrated graphics within Strix Halo achieves performance levels comparable to a desktop RTX 3060 graphics card. In certain scenarios, it even approaches the performance of a laptop RTX 4070 GPU.  Coupled with access to a substantial 128GB of shared system memory and a 140W power budget, Strix Halo empowers laptops to handle demanding 4K gaming without the need for a dedicated discrete graphics card. This positions it as an ideal solution for thin-and-light, high-performance laptops.

Industry Impact: AMD Continues to Lead the Mobile APU Arena

Despite ongoing advancements from competitors like Intel's Lunar Lake, Strix Halo establishes a new benchmark with its exceptional integrated graphics performance. Industry analysts suggest that if X3D variants materialize as anticipated, AMD will further solidify its leadership in mobile computing and the rapidly growing field of on-device AI processing.  Based on product launch timelines revealed at CES 2025, the Ryzen AI Max 300 series (including Strix Halo) is expected to become available later this year, with X3D derivatives potentially following shortly thereafter.

Industry experts predict that AMD may leverage the Strix Halo architecture to introduce a Ryzen AI Max X3D series. By stacking additional cache, these processors are expected to deliver a significant boost in responsiveness and energy efficiency, offering enhanced competitiveness for gaming and content creation laptops. This strategy mirrors AMD's successful approach in the desktop market and has the potential to reshape the landscape of high-performance mobile computing.